A Comprehensive Thermal Model For System-Level Electric Drivetrain Simulation With Respect To Heat Exchange Between Components

Chen, Bicheng (Corresponding author); Wulff, Carsten Wilhelm Ingo; Etzold, Konstantin; Manns, Patrick; Birmes, Georg; Andert, Jakob Lukas; Pischinger, Stefan

Piscataway, NJ : IEEE (2020, 2021)
Buchbeitrag, Beitrag zu einem Tagungsband

In: Proceedings of the Nineteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems : ITherm 2020 : ITherm Virtual Conference, July 21-23, 2020 (originally scheduled for May 26-29, 2020), Walt Disney World, Orlando, FL, USA / IEEE, IEEE Electronic Packaging Society
Seite(n)/Artikel-Nr.: 558-567